Method for aligning two substrates by microcoils

摘要

The method involves moving two substrates with respect to each other in a plane parallel to the substrates in an alignment phase. Electrical quantities associated with alignment detection units are measured, and substrate alignment is determined based on variation of the quantities, where the units comprise plane microcoils e.g. measuring microcoil (1a), formed at metallic interconnection levels of the substrates. Current is supplied to the microcoils of one of the substrates, and inductance of the microcoils of the other substrate is measured, where the inductance constitutes the quantities.