| 摘要 |
A stack package is provided to minimize the flow difference due to the height difference of the semiconductor chips by forming a void preventing film with the same height as the stacked semiconductor chips. A substrate(102) includes an electrode terminal(107). A semiconductor chip(104) is stacked on the substrate with a face-up type. A bonding wire(108) electrically connects a bonding pad of the semiconductor chips and the electrode terminal of the substrate. A void preventing film(110) is attached to the side of the stacked semiconductor chip. An encapsulant encapsulates one side of the substrate including the void preventing film, the bonding wire, and the stacked semiconductor chip. The void preventing film has the same height as the stacked semiconductor chips. |
