| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element for inspection in order to implement peeling inspection wherein bonding between a semiconductor element and, for example, an interposer substrate is peeled for checking the bonding state. SOLUTION: A TEG chip 10 as a semiconductor element for inspection, which is originally for use in wafer test, has a size equal to that of a chip other than the TEG chip formed on the same wafer, and has a small number of bumps 10b for peeling inspection at a peripheral part. Thus, since a bonding strength between the TEG chip 10 and, for example, an interposer substrate 30 does not exceed an adhesion strength between the TEG chip 10 and a peeling jig 20 in peeling inspection, bonding between the TEG chip 10 and the interposer substrate 30 can be appropriately peeled to implement the peeling inspection. COPYRIGHT: (C)2009,JPO&INPIT
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