发明名称 |
COF PACKAGING STRUCTURE, METHOD OF MANUFACTURING THE COF PACKAGING STRUCTURE, AND METHOD FOR ASSEMBLING A DRIVER IC AND THE COF PACKAGING STRUCTURE THEREOF |
摘要 |
A COF packaging structure includes a substrate, a first conductive foil, and a second conductive foil. The substrate has a first surface and a second surface opposite to the first surface. The first conductive foil is disposed on the first surface of the substrate and has a first designated pattern for bump bonding. The second conductive foil is disposed on the second surface of the substrate and has a second designated pattern, wherein the area of the second designated pattern is not smaller than the area of the first designated pattern.
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申请公布号 |
US2009206472(A1) |
申请公布日期 |
2009.08.20 |
申请号 |
US20080057387 |
申请日期 |
2008.03.28 |
申请人 |
LIN CHIU-SHUN;CHENG PAI-SHENG |
发明人 |
LIN CHIU-SHUN;CHENG PAI-SHENG |
分类号 |
H01L23/04;H01L21/02;H01L21/66 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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