| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-coated polyimide composite can prevent electroplated copper from running around (reverse running) to a reverse face of a polyimide film, in an adhesive-less flexible laminate (in particular, a bilayer metalizing laminate), or can restrain effectively an edge part of the electroplated copper from growing abnormally in a polyimide film face; a manufacturing method for the composite; and a manufacturing device for the composite. SOLUTION: This metal-coated polyimide composite includes a tie coating layer and a metal seed formed by electroless plating or a dry method on a surface of the polyimide film, and a copper or copper alloy layer formed further thereon by electroplating, and the tie coating layer, wherein the metal seed layer and the copper or copper alloy-plated layer are formed on the whole surface of the polyimide film, and in a position including one part or the whole of a side face of the polyimide film. COPYRIGHT: (C)2009,JPO&INPIT |
