| 摘要 |
<p>A semiconductor device includes a base plate (1), and a semiconductor constituent body (2) formed on the base plate (1). The semiconductor constituent body has a semiconductor substrate (4) and a plurality of external connecting electrodes (5, 12) formed on the semiconductor substrate (4). An insulating layer (14) is formed on the base plate (1) around the semiconductor constituent body (2). A hard sheet (15) is formed on the insulating layer (14). An interconnection (19) is connected to the external connecting electrodes (5, 12) of the semiconductor constituent body (2).</p> |
