| 摘要 |
Package (1) having a sensor assembly (2) with at least one sensitive surface (21) and an attachment surface (22), a carrier element (3) with a sensor attachment area (31), and a sensor attach material (4) for attaching the sensor assembly (2) to the sensor attachment area (31) of the carrier element. The package (1) comprises an encapsulation (5) of a first material, in which the encapsulation (5) covers the sensor attachment area (31) of the carrier element (3) and the sensor attach material (4) and leaves the at least one sensitive surface (21) free from the first material.
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