发明名称 |
DUAL DAMASCENE METAL INTERCONNECT STRUCTURE HAVING A SELF-ALIGNED VIA |
摘要 |
A recessed region containing a line portion and a bulge portion is formed in a hard mask layer. Self-assembling block copolymers containing two or more different polymeric block components that are immiscible with one another are applied within the recessed region and annealed. A cylindrical polymeric block centered at the bulge portion is removed selective to a polymeric block matrix surrounding the cylindrical polymeric block. A via cavity is formed by transferring the cavity formed by removal of the cylindrical polymeric block into a dielectric layer. The pattern in the hard mask layer is subsequently transferred into the dielectric layer to form a line cavity. A metal via and a metal line are formed by deposition and planarization of metal. The metal via is self-aligned to the metal line.
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申请公布号 |
US2009206489(A1) |
申请公布日期 |
2009.08.20 |
申请号 |
US20080034122 |
申请日期 |
2008.02.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LI WAI-KIN;YANG HAINING S. |
分类号 |
H01L23/48;H01L21/3105 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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