SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor device has a plurality of wafers which are laminated to each other, wherein: each wafer comprises an lamination surface to which another wafer is laminated; the lamination surface is provided with an electric signal connecting portion that electrically connects to said another surface so as to form a semiconductor circuit; at least one of the electrical signal connecting portions facing each other is a protruding connection portion that protrudes from the lamination surface; and a reinforcing protruding portion that is insulated from the semiconductor circuit and is provided in an area where the protruding connection portion is not disposed on the lamination surface formed with the protruding connection portion so as to protrude from the lamination surface with a height equal to or larger than that of the protruding connection portion.