| 摘要 |
<p>The present invention relates to a pick-and-place method and a corresponding pick-and-place apparatus for mounting electronic components, for example surface mounted device (SMD) components, on a substrate, in particular on a large-surface/large-area substrate. According to the invention, the pick-and-place apparatus comprises a material transport and support device (2), an x-y-positioning device (4) with one or several mounted electronic component mounting heads (5), wherein in at least one electronic component mounting head (5) comprises a visual system (8) for identifying form and/or position parameters of the head, substrate and/or component/s, a head rotation or translation system (10), one or several electronic component feeders (12), an electronic component mounting device (16). The apparatus also preferably has an electronic component testing device (18) for directly testing the component after mounting, and a control interface (20) for adjusting the parameters of the apparatus, in particular the form and/or position parameters of the head, substrate and/or component/s.</p> |
