| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the size, and to minimize adverse effects on the environment caused by elution of a lead component by reducing soldering. <P>SOLUTION: Since a semiconductor circuit chip 30, wherein an electric circuit for processing an output signal from a semiconductor sensor chip 40 is formed in a semiconductor chip, an acceleration sensor device 1 can be miniaturized. A sensor body 20 is flip-chip mounted on a terminal 4 by a stud bump 13, and thereby it does not require conventional soldering of circuit boards on a terminal, there is no possibility of having adverse effects on the environment, caused by the elution of a lead component contained in the solder. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
