| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reactive phosphorus-containing epoxy resin suitable for a copper-clad laminate used for an electronic circuit substrate and a sealing material, a molding material, a casting material, an adhesive, an electric insulation coating material, an electric insulation sheet, copper foil with resin, a prepreg, and an electric laminate used in an electronic component, and to provide a phosphorus-containing epoxy resin composition. SOLUTION: The highly-reactive phosphorus-containing epoxy resin is obtained by setting a content of a phosphorus-containing phenol compound, which is represented by general Formula 2 and contains only one phenolic hydroxy group, to≥2.5% when the phosphorus-containing phenol compound represented by the formula 2 is used. In the formula 2: n is 0 or 1; R1 and R2 may the same or different and each has a straight chain structure, a branched chain structure, or a cyclic structure, or R1 and R2 may connect to each other to form a cyclic structure; and B is any of benzene, biphenyl, naphthalene, anthracene, phenanthrene, and hydrocarbon-substituted derivatives of these compounds. COPYRIGHT: (C)2009,JPO&INPIT |
