发明名称 METHOD FOR MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board including a columnar electrode connected with a wire, by which reliability in electric connection between the columnar electrode and the wire is fully secured and a width of the wire is prevented from being narrower than a predetermined wire width. SOLUTION: The columnar electrode 16 made of a first conductive material is formed. Then, a metallic layer 58 made of a second conductive material different from the first conductive material is formed to cover a surface 16A of the electrode 16. Thereafter, an insulation layer 17 is formed to cover a side face of the electrode 16, an upper surface 58A and a side face of the metallic layer 58. Then, the insulation layer 17 is removed from a side of a surface 17B of the insulation layer 17 until the upper surface 58A of the metallic layer 58 is exposed. Thereafter, the metallic layer 58 is removed by an etchant which does not etch the first conductive material to expose, from the insulation layer 17, the surface 16A of the columnar electrode 16 at a part connected with the wire 18. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009188022(A) 申请公布日期 2009.08.20
申请号 JP20080023869 申请日期 2008.02.04
申请人 SHINKO ELECTRIC IND CO LTD 发明人 FUKASE KATSUYA
分类号 H05K3/40;H05K1/09;H05K3/18 主分类号 H05K3/40
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