| 摘要 |
A semiconductor device and a manufacturing method thereof are provided to precisely arrange a position of a mounting substrate and a semiconductor chip by improving visibility of an alignment mark. A region for forming an alignment mark forms an alignment mark used in a position decision in mounting a semiconductor chip on a mounting substrate(1S). An integrated circuit is formed on a region for forming an integrated circuit. The alignment mark includes a mark region which forms a mark and a background region which surrounds the mark region. An isolation region(STI) and lines(GR1,GR2,GR3) are formed on the region for forming the integrated circuit. A first pattern(P1a,P1b) is formed in a bottom layer of the background region of the alignment mark. |
