| 摘要 |
<p>A stack package is provided to improve electrical reliability and a height of a stack package by forming the stack package using a metal wire having a short length. A first semiconductor package(110) includes a first sealing part(118) and a first external contact terminal. A groove(H) having a fixed depth is formed on a top part of the first sealing part. A second semiconductor package(120) includes a second sealing part(128) and a second external contact terminal(129) inside the groove of the first semiconductor package. A first substrate(112) is connected to the second external contact terminal. A second substrate(122) is arranged in a bottom part of the first semiconductor package, and is connected to the first external contact terminal. An electrical connection part is formed between the first substrate and the second substrate.</p> |
