WAFER SAWING EQUIPMENT IMPROVING A COOLING FUNCTION

摘要

A wafer sawing device improving a cooling function is provided to prevent an adhesive layer from being adhered to a base film or a semiconductor chip by cooling down frictional heat generated in a wafer cutting process through a chuck table. A wafer sawing device includes a body, a wafer sawing chuck table(100), a thermoelectric plate(102), a plurality of cooling pines(104), and a heat discharging plate(106). The wafer sawing chuck table is arranged in an inner part of the body. The thermoelectric plate is arranged on the chuck table. The thermoelectric plate is a Peltier effect material. A plurality of cooling pins are formed on the thermoelectric plate. The plurality of cooling pins are formed with a mesh shape. The heat discharging plate is attached to the lower part of the thermoelectric plate.