| 摘要 |
A gold alloy bonding wire made of an alloy which comprises 5-100 mass ppm magnesium, 5-20 mass ppm indium, 5-20 mass ppm aluminum, 5-20 mass ppm ytterbium, and gold having a purity of 99.995 mass% or higher as the remainder. The alloy may further contain one or more members selected among 5-20 mass ppm calcium, 5-20 mass ppm lanthanum, 5-20 mass ppm lutetium, 5-100 mass ppm tin, and 5-100 mass ppm strontium. These gold alloys may further contain 0.01-1.2 mass% palladium. The bonding wire eliminates a secondary bonding failure caused by the deposition of an oxide of an additive element. ® KIPO & WIPO 2009 |
