| 摘要 |
PROBLEM TO BE SOLVED: To detect and correct a wafer shift if the wafer shift is made in a chamber processing room of a plasma device used in a stage of manufacturing the semiconductor device. SOLUTION: In the chamber processing room 1, a wafer 2 is conveyed by a conveyance arm 2 and mounted on a lower electrode 3. The wafer 2 is sucked to the lower electrode 3 and subjected to plasma processing, and dechucked after the processing is completed. Then the position of the wafer 2 is confirmed by an infrared sensor 16. When the infrared sensor 16 reacts at this time, a shift of the wafer in the reaction direction is detected. When the wafer shift is detected by the infrared sensor 16, a wafer position feedback system 44 feeds the direction and amount of the wafer shift back to the conveyance arm 42, and the conveyance arm 42 is inserted into the chamber processing room 1 to carry the wafer 2 out. COPYRIGHT: (C)2009,JPO&INPIT
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