| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board, capable of attaining efficiency of manufacturing. <P>SOLUTION: This manufacturing method of the multilayer printed wiring board is equipped with a process for forming a laminate 11, by laminating an inner layer core material 1, outer layer materials 2 and 3, while positioning them; a process to temporarily fix the inner layer core material 1 and the outer layer materials 2 and 3; and a process to mutually bond the inner layer core material 1 to the outer layer materials 2 and 3. The process for temporarily fixing the inner layer core material 1 and the outer layer materials 2 and 3 includes a process for forming a temporarily fixing hole 11a in a prescribed part of the laminate 11 and injects the temporarily fixing material 10, made of an epoxy based adhesive, into the temporarily fixing hole 11a of the laminate 11; and the inner layer core material 1 and the outer layer materials 2 and 3 are temporarily fixed by the temporarily fixing material 10 injected into the temporarily fixing hole 11a of the laminate 11. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
