摘要 |
PROBLEM TO BE SOLVED: To dip up a thin slice onto a substrate along the substrate to prepare a thin slice specimen, while controlling orientation, by a simple constitution, and to thereby reduce maximally a load imposed on an operator. SOLUTION: A thin slice specimen preparation device 1, for dipping up the thin slice M floating on a liquid surface 2b while being eliminated from a conveyance body 20 onto the substrate G, includes: a liquid tank 2 for storing liquid 2a into which the end of the conveyance body is dipped; a gripping part 3 for gripping the substrate so that a lateral width direction of the substrate becomes parallel to one side of the thin slice; a pulling-up mechanism 4 for pulling up the gripping part along the substrate; and a control part 6 for controlling an operation timing of the mechanism and pulling up speed. The gripping part grips the substrate so that part of the thin slice remains on the conveyance body at a timing when the thin slice is brought into contact with the substrate surface, and the control part controls so that relative movement of the thin slice to the substrate is generated at prescribed moving speed only along an approximately vertical direction in a plan view with respect to the lateral width direction, and that the speed becomes approximately equal to the pulling up speed. COPYRIGHT: (C)2009,JPO&INPIT
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