SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, METHOD FOR RECEIVING SIGNAL USING SEMICONDUCTOR DEVICE AND TESTER DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress an increase in a chip size at a time when a signal is transmitted and received to and from the outside by a non-contact.

SOLUTION: A semiconductor device 100 contains a semiconductor substrate 102 and bonding pads 110 formed on the semiconductor substrate 102. The semiconductor device 100 further contains inductors 112 being laminated and formed on the bonding pads 110 on the semiconductor substrate 102 and transmitting and receiving signals to and from the outside by the non-contact by an electromagnetic induction.

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