METHOD FOR REDUCING NUMBER OF DEFECT OF PATTERN COLLAPSE IN MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for reducing the number of defects of a semiconductor device during manufacturing, particularly, pattern collapse without scarifying the throughput, and to provide a process solution for the method. SOLUTION: A process solution comprising one or more surfactants is used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. COPYRIGHT: (C)2009,JPO&INPIT