<p>A multilayer printed circuit board may include a first layer, a second layer, and a third layer, the second layer being between the first layer and the second layer. The second layer may include a spark gap.</p>
申请公布号
WO2009098553(A1)
申请公布日期
2009.08.13
申请号
WO2008IB53161
申请日期
2008.08.06
申请人
SONY ERICSSON MOBILE COMMUNICATIONS AB;OMEROVIC, IDRIS
