| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent abnormality due to dew condensation in a hollow caused by heat applied when a semiconductor device is mounted on a set substrate. <P>SOLUTION: A titanium oxide film 14 is deposited on a cap 1 of the semiconductor device 1A. The semiconductor device 1A is manufactured by bonding the cap to a frame 5 so that a surface of the titanium oxide film 14 faces a hollow-side semiconductor element 2. A lead frame 6 of the manufactured semiconductor device 1A is mounted on the set substrate 10 using solder 9. The titanium oxide film 14, imparted with super-hydrophilicity and a photocatalyst function, of the semiconductor device 1A is irradiated with ultraviolet light to prevent dew condensation due to moisture produced during mounting. <P>COPYRIGHT: (C)2009,JPO&INPIT |
