发明名称 GRINDING MACHINE OF SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a grinding machine of a semiconductor substrate, making a sliding resistance extremely minute at a seal part, controlling a fluctuation of a machining pressure to be minute, and making a machining deteriorated layer extremely thin. SOLUTION: A non-contact detour seal is formed of: an inside cap 1, with a front end attached to a periphery of a jig 25 faced toward a processing chamber 29, and an outside cap 2, with a front end attached to an inner peripheral part of an opening part of a processing chamber cover 28 facing the inside cap 1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009178817(A) 申请公布日期 2009.08.13
申请号 JP20080021485 申请日期 2008.01.31
申请人 HITACHI CABLE LTD 发明人 SOMA TAKUYA;MIYATA HIDEHIRO;OBARA HIROMI
分类号 B24B55/06;H01L21/304 主分类号 B24B55/06
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