发明名称 |
INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE |
摘要 |
An electronic circuit in an integrated circuit package comprises an inductance element. The inductance element further comprises a plurality of separated metal strips formed on a substrate and a ferrite core coupled to the substrate. The metal strip plurality is formed between the substrate and the ferrite core. The inductance element further comprises a plurality of wires coupled to the separated metal strips whereby the metal strips and wires form a continuous coil. The ferrite core is interposed between the metal strip plurality and the wire plurality.
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申请公布号 |
US2009201115(A1) |
申请公布日期 |
2009.08.13 |
申请号 |
US20080030669 |
申请日期 |
2008.02.13 |
申请人 |
GHOSHAL SAJOL;CRAWLEY PHILIP JOHN |
发明人 |
GHOSHAL SAJOL;CRAWLEY PHILIP JOHN |
分类号 |
H01F5/00;H01F41/00 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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