METAL-CLAD LAMINATE

摘要

The present invention relates to a flexible metal-clad laminate for a printed circuit board and a method of manufacturing the same. The flexible metal-clad laminate includes: a first polyimide layer that is disposed on one surface of the metal -clad and has thermal expansion coefficient of 20ppm/K or less; and a second polyimide layer that is disposed on one surface of the first polyimide layer and has thermal expansion coefficient of 20ppm/K or more, wherein a difference between the thermal expansion coefficients of the first and second polyimide layers is within 5ppm/K and a glass transition temperature Tg of resin of the first polyimide layer is 300°C g < 350°C, which is lower than a maximum curing temperature.