| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide electronic equipment capable of achieving high cooling performance. <P>SOLUTION: This electronic equipment 1 includes: a first heat receiving member 24 mounted on a heat pipe 23, and faced to a first heating component 13; a first pressurizing member 27 for pressurizing the first heat receiving member 24 toward the first heating component 13 along a direction vertical to a circuit board 12; a second heat receiving member 25 mounted on the heat pipe 23; a heat transmission member 26; a second pressurizing member 28 for pressurizing the first member 41 of the heat transmitting member 26 toward the second heating component 14 along a direction vertical to a circuit board 12; and a third pressurizing member 29 for pressurizing a second heat receiving member 25 toward a second section 42 of the heat transmitting member 26 along a direction parallel with the circuit board 12. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
