| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for producing a semiconductor device, wherein the variation of the formation of a plating film on a plated semiconductor substrate is suppressed. SOLUTION: Bubbles remaining on the surface of a filter (C)8 provided in an anode electrode mounted vessel 2 installed in a plating bath 1 are removed by vibrating the filter (C)8 to suppress the change of electric field largely affecting the formation of the electric field plating film. COPYRIGHT: (C)2009,JPO&INPIT
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