| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating method which inhibits gold from abnormally depositing between wiring patterns in electroless plating, and consequently does not damage a desired wiring pattern. SOLUTION: The electroless plating method includes: an electroless nickel-plating step of forming an electroless nickel-plated film on the surface of a wiring pattern of a metal sintered compact, in a glass ceramic wiring substrate constituted by an insulative substrate made from glass ceramic and the wiring pattern of the metal sintered compact; a displacement-type electroless gold-plating step of forming a displacement-type electroless gold-plated film on the electroless nickel-plated film; and a reduction-type electroless gold-plating step of forming a reduction-type electroless gold-plated film on the displacement-type electroless gold-plated film; and further includes a glass etching step conducted in between the electroless nickel-plating step and the displacement-type electroless gold-plating step or in between the displacement-type electroless gold-plating step and the reduction-type electroless gold-plating step. COPYRIGHT: (C)2009,JPO&INPIT
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