AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, KIT FOR PREPARING THE DISPERSION, METHOD FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USING THE KIT, AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE

摘要

Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains (A) a compound having a nitrogen-containing five-membered ring and a carboxyl group, (B) at least one amino acid selected from glycine, alanine and aspartic acid, (C) an oxidizing agent, (D) abrasive grains and (E) an anionic surfactant. The ratio between the amount (WA) [% by mass] of the component (A) contained therein and the amount (WB) [% by mass] of the component (B) contained therein, namely WA/WB, is not less than 0.5 but not more than 50.