| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate actualizing a processing for peeling a support frame supporting a substrate from the substrate without deteriorating a dicing tape, and to provide a processing method of the substrate. SOLUTION: The laminate includes the substrate 10 which is made into a thin plate and the support plate 10, and has a first support plate 12 stuck on one surface 10a of the substrate with a first adhesive interposed and a second support plate 14 stuck on the other surface of the substrate 10 with a second adhesive interposed, the laminate is characterized in that the second adhesive has solubility different from that of the first adhesive and the first plate 12 and second support plate 14 can be excellently peeled from the substrate 10. COPYRIGHT: (C)2009,JPO&INPIT |
