| 摘要 |
PROBLEM TO BE SOLVED: To provide a configuration for dissipating the heat of a heat sink to the outside in a semiconductor laser device for which a semiconductor laser chip is mounted on the heat sink mechanically and electrically bonded on a stem. SOLUTION: In the semiconductor laser device for which the semiconductor laser chip 1 is installed on the heat sink 3 mechanically and electrically bonded on the stem 4 and leads such as an LD lead, a PD lead and a common lead for inputting and outputting a current from the stem 4 to the device such as the semiconductor laser chip 1 are planted, one end of the common lead 7 is bonded to the heat sink 3. COPYRIGHT: (C)2009,JPO&INPIT
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