发明名称 |
RESIN COMPOSITION, PREPREG, LAMINATE, AND WIRING BOARD |
摘要 |
To provide a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, a prepreg, a laminate, and a wiring board. A resin composition for use in production of a laminate, the resin composition comprising an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher. |
申请公布号 |
US2009200071(A1) |
申请公布日期 |
2009.08.13 |
申请号 |
US20070298168 |
申请日期 |
2007.04.26 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
MORITA KOJI;TAKANEZAWA SHIN;SAKAI KAZUNAGA;KONDOU YUUSUKE |
分类号 |
H05K1/00;B05D3/02;B32B5/02;C08G59/00;C08G59/04;C08G59/06;C08G65/38;C08L71/12 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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