| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a connection substrate. <P>SOLUTION: The connection substrate is manufactured such that a composite metal layer including three metal layers on one face or both faces of a support substrate is arranged; after temporarily fixed by heating and pressing, a part of the composite metal layer is selectively removed to form a connecting conductor; an insulation resin composition layer is formed so as to cover side faces of the obtained connecting conductor; then, the insulation resin composition layer is polished so that the connecting conductor is exposed; the composite metal layer formed so that the connecting conductor passes through in a direction of the insulation resin composition layer is peeled off from the support substrate; and remaining metal layers are selectively removed to form conductor circuits. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
