INTERCONNECTION BOARD AND ITS MANUFACTURING METHOD, AND MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an interconnection board and its manufacturing method capable of improving the adhesion between a through-hole conductor and an inner wall surface of the through-hole, and to provide a mounting structure.

SOLUTION: The interconnection board 2 comprises: a base substance 5 with a plurality of film layers 8 and adhesion layers 9 alternately laminated; a through-hole S penetrating through the base substance 5; a convex part 8a with a part of the film layer 8 formed so as to protruding from the inner wall surface of the through-hole S to the inside of the through-hole S; and a through-hole conductor 10 formed along the inner wall surface of the through-hole S and coating the surface of the convex part 8a.

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