发明名称 |
RESIN COMPOSITION, RESIN MOLDED PRODUCT, AND COATED PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition reducing occurrence of cracks in preparation of a cured product obtained by single compound system cationic polymerization of a compound having an oxetanyl group. SOLUTION: The resin composition comprises a compound (A) having an oxetanyl group, a hindered amine compound (B), and a cationic polymerization initiator (C). When the hindered amine compound (B) is added when performing cationic polymerization of the compound (A) having an oxetanyl group by the cationic polymerization initiator (C), occurrence of cracks in the cured product can be suppressed in the curing molding process. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009179709(A) |
申请公布日期 |
2009.08.13 |
申请号 |
JP20080019554 |
申请日期 |
2008.01.30 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
TAKAMURA NORIHIRO;YOKOGAWA HIROSHI;YODA HIROYOSHI |
分类号 |
C08G65/26;C09D7/12;C09D171/00 |
主分类号 |
C08G65/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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