发明名称 RESIN COMPOSITION, RESIN MOLDED PRODUCT, AND COATED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition reducing occurrence of cracks in preparation of a cured product obtained by single compound system cationic polymerization of a compound having an oxetanyl group. SOLUTION: The resin composition comprises a compound (A) having an oxetanyl group, a hindered amine compound (B), and a cationic polymerization initiator (C). When the hindered amine compound (B) is added when performing cationic polymerization of the compound (A) having an oxetanyl group by the cationic polymerization initiator (C), occurrence of cracks in the cured product can be suppressed in the curing molding process. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009179709(A) 申请公布日期 2009.08.13
申请号 JP20080019554 申请日期 2008.01.30
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 TAKAMURA NORIHIRO;YOKOGAWA HIROSHI;YODA HIROYOSHI
分类号 C08G65/26;C09D7/12;C09D171/00 主分类号 C08G65/26
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