| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a probe pad such that a tip of a probe pin can be securely brought into contact, and an electronic device using the same. <P>SOLUTION: Disclosed are a plurality of probe pads 14 disposed on one side of a semiconductor chip apart from one another in one direction; and probe pads 14a of a center portion are disposed in parallel to one another, and probe pads 14b and 14c on both sides of the probe pads 14a of the center portion are disposed obliquely to the probe pads 14a of the center portion. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
