发明名称
摘要 PROBLEM TO BE SOLVED: To provide a power distributer of simple and thin structure which enables superior distribution of electric power from a power source mounted on a vehicle to each electronic unit, and a method which can manufacture the distributer with a simple process. SOLUTION: In a power distributer using semiconductor switching elements, input terminals 10I, 10L, output terminals 12A-12J and, further preferably, terminals 30, 32 for a substrate are constituted of metal plates, and arranged on the same plane perpendicular to the plate thickness direction. The metal plates can be integrated by resin molding, so that the structure is very simplified. This power distributer can be simply manufactured by a method wherein prescribed parts of the metal plate are cut after blanking and resin molding the metal plates, and the semiconductor switching elements are mounted.
申请公布号 JP4312343(B2) 申请公布日期 2009.08.12
申请号 JP20000077550 申请日期 2000.03.21
申请人 发明人
分类号 B60R16/02;H02J1/00;H02G3/16;H02J7/00 主分类号 B60R16/02
代理机构 代理人
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