发明名称 |
Method for measurement of a device under test |
摘要 |
A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.
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申请公布号 |
US7573283(B2) |
申请公布日期 |
2009.08.11 |
申请号 |
US20070765019 |
申请日期 |
2007.06.19 |
申请人 |
SUSS MICRO TEC TEST SYSTEMS GMBH |
发明人 |
SCHMIDT AXEL;FEHRMANN FRANK;HACKIUS ULF;KANEV STOJAN;LAUBE STEFFEN;KIESEWETTER JORG |
分类号 |
G01R31/06 |
主分类号 |
G01R31/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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