| 摘要 |
A method for manufacturing a chip antenna is invented, which comprises forming multiple meandered lines, folding the meandered line set, and forming a package to encapsulate a three-dimensional antenna structure. The material of the package is a dielectric composite formed with polymers and ceramic powders, which has a dielectric constant designed for the antenna. The characteristics of the chip antenna are determined by the structures of the antenna body and the dielectric constant of the package. Thus, a requirement for miniature structures in antenna applications can be satisfied.
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