发明名称 Semiconductor device for reducing forward voltage by using OHMIC contact
摘要 MOS FETs are formed by a drain layer 101, a drift layer 102, P-type body areas 103, N+-type source areas 105, gate electrodes 108, a source electrode film 110, and a drain electrode film 111. In parallel to the MOS FETs, the drain layer 101, the drift layer 102, the P--type diffusion area 109, and the source electrode film 110 form a diode. The source electrode film 110 and the P--type diffusion area 109 form an Ohmic contact. The total amount of impurities, which function as P-type impurities in each P-type body area 103, is larger than the total amount of impurities, which function as P-type impurities in the P--type diffusion area 109.
申请公布号 US7573096(B2) 申请公布日期 2009.08.11
申请号 US20050883939 申请日期 2005.02.16
申请人 SHINDENGEN ELECTRIC MANUFACTURING CO, LTD. 发明人 TAKEMORI TOSHIYUKI;WATANABE YUJI;SASAOKA FUMINORI;MATSUYAMA KAZUSHIGE;OHSHIMA KUNIHITO;ITOI MASATO
分类号 H01L29/76;H01L29/94;H01L31/062;H01L31/113 主分类号 H01L29/76
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