EPOXY COMPOSITION FOR ADHESION STRENGTHENING OF PREPREG AND COPPER, EPOXY ADHESIVE

摘要

An epoxy composition is provided to apply a stacking process of prepreg and copper through a laminating method, to perform a lamination process of copper and prepreg at a low temperature in a short time, and to improve adhesion power of copper and prepreg. An epoxy composition for enhancing adhesion of prepreg and copper comprises a thermosetting resin 100~500 parts by weight; a rubber 10~200 parts by weight for imparting flexibility; a filler 100~300 parts by weight for compensating mechanical properties of the thermosetting resin; additive 10~100 parts by weight for controlling the surface in the processing of the composition; organic solvent 50~400 parts by weight for processability; and a hardener 100~400 parts by weight for coating properties of the composition.