| 摘要 |
PROBLEM TO BE SOLVED: To provide a photo-curable or electron beam-curable adhesive resin composition which has excellent adhesion to adherends such as metal oxides and metals, and is high in glass transition temperature after curing and suitable as an adhesive material for electronic components. SOLUTION: A photo-curable or electron beam-curable adhesive resin composition containing a bifunctional urethane (meth)acrylate oligomer (A) and a monomer component (B) is provided, wherein the urethane (meth)acrylate oligomer (A) contains a urethane prepolymer moiety composed of a polycarbonate diol and a polyisocyanate and the repetition number (n) of the urethane prepolymer moiety is 10-30, and the monomer component (B) contains a cyclic monomer having a (meth)acryloyl group. COPYRIGHT: (C)2009,JPO&INPIT |
