发明名称 |
METHOD OF MANUFACTURING COPPER WIRING INSULATION FILM, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an unprecedented method of manufacturing a copper wiring insulation film capable of forming a fine wiring which has excellent bondability between a copper foil and an insulation film and is excellent in linearity by using a semi-additive method while using an ultra-fine copper foil laminate insulation film, and is excellent in circuit visibility. SOLUTION: The method for manufacturing a copper wiring insulation film by a semi-additive method uses a copper foil laminate insulation film in which a copper foil is laminated on a single surface or both surfaces of an insulation film, wherein the copper foil laminate insulation film is obtained by laminating a copper foil having following features (a) and (b) to the insulation film. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009176770(A) |
申请公布日期 |
2009.08.06 |
申请号 |
JP20080010705 |
申请日期 |
2008.01.21 |
申请人 |
UBE IND LTD |
发明人 |
BANBA KEITA;YOKOZAWA YOSHIHIRO;SHIMOKAWA HIROTO;NARUI KOJI |
分类号 |
H05K1/09;H01B13/00;H05K3/18 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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