| 摘要 |
In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use of differential wire bond signal transmission, the inherent inductance of a millimeter wave package can be matched by the capacitance of the package wire bonds if the capacitance is tailored. The capacitance can be tailored by calculating a suitable distance between wire bonds and tuning the dielectric constant of the over-mold material. A differential set of wire bonds act like a differential transmission line whose characteristic impedance can be tuned by configuring the dielectric constant of the over-mold of the millimeter wave package.
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