| 摘要 |
An apparatus for depositing a coating onto a surface of a substrate comprising: -a vacuum chamber (5) with an inlet (2) for supplying a precursor gas to the chamber, the chamber comprising, -a carrier (6) for locating the substrate (8) in the chamber, the substrate, when located in the carrier constituting a first cathode; -a first anode (3) having an aperture in which a plasma can be formed, and -a magnetic field source, wherein, in use, a substantially linear magnetic field between the anode and the cathode is formed such that the direction of the magnetic field is substantially orthogonal to the surface to be coated and plasma production and deposition takes place substantially within the linear field. |
