RESIN SHEET FOR CIRCUIT BOARD, SHEET FOR CIRCUIT BOARD, AND CIRCUIT BOARD FOR DISPLAY

摘要

Disclosed is a resin sheet formed of an energy beam curable polymer material. When the resin sheet is irradiated with ultraviolet light at an exposure of 300 mJ/cm2 and cured, the percentage swelling of the cured resin sheet is not more than 4.0% as measured after immersion of the cured resin sheet in ethanol of 23°C for 10 min. The percentage swelling is defined as follows. Percentage swelling (%) = ((sheet thickness after immersion - sheet thickness before immersion)/sheet thickness before immersion) × 100 A resin sheet (2) provided on a support (1) is pressed against a circuit chip (3) placed on a glass substrate (4). As a result, the circuit chip is embedded in the resin sheet (2). Thereafter, the resin sheet (2) is irradiated with ultraviolet light and cured. The cured resin sheet (2) is separated from the glass substrate (4) and is used as a circuit board for a display.