COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE COPPER ALLOY MATERIAL

摘要

Provided is a copper alloy material for electric/electronic components, which includes Co by 0.2-2 mass% and Si by 0.05-0.5 mass%, and the rest is composed of Cu and unavoidable impurities. The copper alloy material has a crystal grain diameter of 3-35µm, a size of precipitate including both Co and Si at 5-50nm, a conductivity of 50% IACS or higher, a tensile strength of 500MPa or higher, and a bending workability (R/t) of 2 or less.