| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, which is excellent in low thermal expansibility and moldability, has high heat conductivity when compounded with an inorganic filler, and gives packages excellent in low thermal expansibility, heat resistance and moisture resistance. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler. In the epoxy resin composition, 50wt% or more of the epoxy resin component is an epoxy resin having a 1,4-phenylene structure, 50wt% or more of the curing agent component is a bifunctional phenolic compound, and the content of the inorganic filler is 86-96wt% of all of the composition. COPYRIGHT: (C)2009,JPO&INPIT |
